300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports
MILPITAS,California,Sept. 3,2019 --Worldwide semiconductor manufacturing equipment billings reached US$13.3 billion in the second quarter of 2019,down 20 percent from the same quarter of 2018 and 3 percent from than the previous quarter,SEMI,the global industry association representing the electronics manufacturing and design supply chain,reported today.
Fab equipment spending and volume fabs/lines count 2012-2023 and high-probability fab projects
The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from more than 80 global equipment companies that provide data on a monthly basis.
The quarterly billings data by region in billions of U.S. dollars,quarter-over-quarter growth and year-over-year rates by region are as follows:
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Monthly SEMI Billings Report,which offers a perspective of the trends in the equipment market
Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS),a detailed report of semiconductor equipment billings for seven regions and 24 market segments
SEMI Total OEM Semiconductor Equipment Forecast,which provides an outlook for the semiconductor equipment market
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About SEMI
SEMI® connectsmore than 2,100member companies and 1.3 millionprofessionals worldwidetoadvance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials,design,equipment,software,devices,and services that enable smarter,faster,morepowerful,and more affordable electronic products.Electronic System Design Alliance (ESD Alliance),FlexTech,the Fab Owners Alliance (FOA)and theMEMS& Sensors Industry Group (MSIG) are SEMI Strategic Association Partners,defined communities within SEMI focused on specific technologies. Visit www.semi.orgtolearnmore,contact one of our worldwide offices,and connect with SEMI onLinkedInandTwitter.
Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org
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