SJSemi Successfully Closed $300M of Series C Financing

JIANGYIN,China,March 16,2022 -- SJ Semiconductor Co. (SJSemi),a leading MEOL (Middle-End-Of-Line) foundry specializing on advanced Bumping and 3D Multi-Die Integration technology,is pleased to announce that its Series C financing of $300 million has been fully closed.

Previously,SJSemi and a variety of investors signed the Series C shares purchase agreement in September 2021,and received the initial closing of US$108 million in next month. Recently,the remaining investors have obtained relevant approval and completed the funding with the remaining US$192 million.

The successful closing of the Series C financing enables the company to continue growing according to its business plan and strengthen its leading position in advanced packaging. On January 21,2022,SJSemi announced to expand investment in Jiangyin by $1.6 billion; On February 18th,SJSemi held a ceremony of J2B fab ground breaking for its 3D Multi-Die packaging project. After completion of the J2B,SJSemi will have the monthly capacity of 120K wafer level packaging and 20K 3D Multi-Die integration packaging.

Since the equity restructure in 2021,the newly joined shareholders include CMBI,CICC Capital,Oriza Rivertown,Oriza Hua Capital,Walden CEL,CCB PE,CCB Trust,Growth,Country Garden Venture,HTPE,SCGC,CITIC Securities and GP Capital etc. The Series C funding brings SJSemi's total equity raised to $630 million.

About SJSemi

Located in Jiangyin,Jiangsu Province,SJSemi was founded in August 2014. Starting with the advanced 12-inch bumping and wafer testing,SJSemi aims to offer first-class Middle-End-Of-Line (MEOL) manufacturing and testing services and develop the advanced 3D Multi-Die Integration technology and solutions. SJSemi thrives to provide a high quality one-stop advanced packaging service to local and international IC design houses for customer's local and global competitiveness.