ChipMOS REPORTS JULY 2019 REVENUE
HSINCHU,Aug. 6,2019 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS"or the "Company") (Taiwan Stock Exchange:8150 and NASDAQ: IMOS),an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),today reported its unaudited consolidated revenue for the month of July 2019. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$31.09 toUS$1.00 as ofJuly 31,2019.
Revenue for the month of July 2019was NT$1,737.3million or US$55.9 million,an increaseof6.1%fromthe month ofJune 2019 and an increaseof10.2% fromthe same period in2018. The Company noted that it is benefiting from continued growth led by the addition of new NAND flash business,diversification of gold bumping for DDIC to wafer bumping of non-DDIC products,and improved customer inventory levels.
Consolidated Monthly Revenues (Unaudited)
July 2019
June 2019
July 2018
MoM Change
YoY Change
Revenues
(NT$ million)
1,737.3
1,636.7
1,576.7
6.1%
10.2%
Revenues
(US$ million)
55.9
52.6
50.7
6.1%
10.2%
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC.(Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park,Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan,ChipMOS provide assembly and test services to a broad range of customers,including leading fabless semiconductor companies,integrated device manufacturers and independent semiconductor foundries.
Forward-Looking Statements
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of,among other things,strategy,goals,plans or intentions. These statements may include financial projections and estimates and their underlying assumptions,statements regarding plans,objectives and expectations with respect to future operations,products and services,and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document,due to various factors. Further information regarding these risks,uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company's other filings with the SEC.
Contacts:
In Taiwan
Jesse Huang
ChipMOS TECHNOLOGIES INC.
+886-6-5052388 ext. 7715
jesse_huang@chipmos.com
In the U.S.
David Pasquale
Global IR Partners
+1-914-337-8801
dpasquale@globalirpartners.com
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