ChipMOS REPORTS DECEMBER 2019 AND 4Q19 REVENUE; 4Q19 REVENUE INCREASES 12.1% YoY and 3.2% QoQ; HIGHEST QUARTERLY LEVEL SINCE 1Q15

HSINCHU,Jan.8,2020 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS"or the "Company") (Taiwan Stock Exchange:8150 and NASDAQ: IMOS),an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),today reported its unaudited consolidated revenue for the month of December 2019.All U.S. dollar figures cited in this press release are based on the exchange rate of NT$29.91 toUS$1.00 as ofDecember 31,2019.

Revenue for thefourth quarter of 2019 was NT$5,571.5 million or US$186.3 million,representing an increase of 3.2%fromthe third quarter of 2019,and an increase of 12.1%from the fourthquarter of 2018. This represents the highest quarterly revenue level since the first quarter of 2015. The Company noted that it benefitted from continued growth throughout 2019 led by demand strength in its core business,the addition of new NAND flash business,diversification of gold bumping for DDIC to wafer bumping for non-DDIC products,stronger TDDI demand,all of which resulted in higher utilization levels.

Revenue for the month of December 2019was NT$1,823.5million or US$61.0 million,a decreaseof1.4%fromthe month ofNovember 2019 and an increaseof18.6% fromthe same period in2018.

Consolidated Monthly Revenues (Unaudited)

December2019

November 2019

December2018

MoM Change

YoY Change

Revenues

(NT$ million)

1,823.5

1,849.1

1,538.0

-1.4%

18.6%

Revenues

(US$ million)

61.0

61.8

51.4

-1.4%

18.6%

Consolidated Quarterly Revenues (Unaudited)

Fourth Quarter 2019

Third Quarter

2019

Fourth Quarter 2018

QoQ Change

YoY Change

Revenues

(NT$ million)

5,571.5

5,399.1

4,972.3

3.2%

12.1%

Revenues

(US$ million)

186.3

180.5

166.2

3.2%

12.1%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC.("ChipMOS"or the "Company")(Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park,Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan,ChipMOS provide assembly and test services to a broad range of customers,including leading fabless semiconductor companies,integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of,among other things,strategy,goals,plans or intentions. These statements may include financial projections and estimates and their underlying assumptions,statements regarding plans,objectives and expectations with respect to future operations,products and services,and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document,due to various factors. Further information regarding these risks,uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company's other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

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