ChipMOS REPORTS 23.5% YoY INCREASE IN SEPTEMBER 2021 REVENUE; 25.9% INCREASE IN 3Q21 REVENUE; NEW RECORD QUARTERLY HIGH
HSINCHU,Oct.8,2021 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS"or the "Company") (Taiwan Stock Exchange:8150 and NASDAQ: IMOS),an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),today reported itsunaudited consolidated revenue for the month of September 2021and for the thirdquarter ended September 30,2021.All U.S. dollar figures cited in this press release are based on the exchange rate of NT$27.84 toUS$1.00 as ofSeptember 30,2021.
Revenue for thethird quarter of 2021 reached a new record quarterly high,increasing 25.9% on a year over year basis to NT$7,161.0 million or US$257.2 million,representing an increase of2.6%from the secondquarter of 2021. The Company noted its DDIC high-end test platforms remain at a high utilization level,helping to drive healthy gross margins.
Revenue for the month of September 2021reached a new record high for September,increasing 23.5% on a year over year basis to NT$2,343.8million or US$84.2 million,representing a decreaseof2.3% compared to August 2021. There was an additional working day in August 2021 compared to September 2021.
Consolidated Monthly Revenues (Unaudited)
September2021
August 2021
September2020
MoM Change
YoY Change
Revenues
(NT$ million)
2,343.8
2,399.3
1,897.1
-2.3%
23.5%
Revenues
(US$ million)
84.2
86.2
68.1
-2.3%
23.5%
Consolidated Quarterly Revenues (Unaudited)
Third Quarter
2021
Second Quarter
2021
Third Quarter
2020
QoQ Change
YoY Change
Revenues
(NT$ million)
7,161.0
6,982.3
5,686.2
2.6%
25.9%
Revenues
(US$ million)
257.2
250.8
204.2
2.6%
25.9%
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC.("ChipMOS"or the "Company")(Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park,Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan,ChipMOS provide assembly and test services to a broad range of customers,including leading fabless semiconductor companies,integrated device manufacturers and independent semiconductor foundries.
Forward-Looking Statements
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of,among other things,strategy,goals,plans or intentions. These statements may include financial projections and estimates and their underlying assumptions,statements regarding plans,objectives and expectations with respect to future operations,products and services,and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document,due to various factors,including the ongoingimpact of COVID-19. Further information regarding these risks,uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company's other filings with the SEC.
Contacts:
In Taiwan
Jesse Huang
ChipMOS TECHNOLOGIES INC.
+886-6-5052388 ext. 7715
IR@chipmos.com
In the U.S.
David Pasquale
Global IR Partners
+1-914-337-8801
dpasquale@globalirpartners.com
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