ChipMOS REPORTS 18.2% QoQ INCREASE IN 2Q23 REVENUE AND SLIGHT MoM DECREASE IN JUNE 2023 REVENUE
HSINCHU,July 10,2023 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS),an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),today reported its unaudited consolidated revenue for the month of June 2023 and for the second quarter ended June 30,2023. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$31.14 to US$1.00 as of June 30,2023.
Revenue for the second quarter of 2023 was NT$5,444.1 million or US$174.8 million,representing an increase of 18.2% from the first quarter of 2023,and a decrease of 20.5% from the second quarter of 2022. The Company noted the above seasonally strong second quarter of 2023 revenue reflects higher demand of LCD drivers across its core business and automotive markets,along with a continued improvement in loading levels of high end test platform.
Revenue for the month of June 2023 was NT$1,788.1 million or US$57.4 million,representing a slight decrease of 2.5% from May 2023,and a decrease of 15.3% from June 2022.
Consolidated Monthly Revenues (Unaudited)
June 2023
May 2023
June 2022
MoM Change
YoY Change
Revenues
(NT$ million)
1,788.1
1,834.3
2,110.8
-2.5%
-15.3%
Revenues
(US$ million)
57.4
58.9
67.8
-2.5%
-15.3%
Consolidated Quarterly Revenues (Unaudited)
Second Quarter
2023
First Quarter
2023
Second Quarter
2022
QoQ Change
YoY Change
Revenues
(NT$ million)
5,444.1
4,605.1
6,851.7
18.2%
-20.5%
Revenues
(US$ million)
174.8
147.9
220.0
18.2%
-20.5%
AboutChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park,Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan,ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies,integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide.
Forward-Looking Statements:
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of,among other things,strategies,goals,plans or intentions. These statements may include financial projections and estimates and their underlying assumptions,statements regarding plans,objectives and expectations with respect to future operations,products and services,and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document,due to various factors. Further information regarding these risks,uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company's other filings with the SEC.
Contacts:
In Taiwan
Jesse Huang
ChipMOS TECHNOLOGIES INC.
+886-6-5052388 ext. 7715
IR@chipmos.com
In the U.S.
David Pasquale
Global IR Partners
+1-914-337-8801
dpasquale@globalirpartners.com