ChipMOS REPORTS DECEMBER 2018 AND 4Q18 REVENUE

HSINCHU,Jan. 10,2019 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS"or the "Company") (Taiwan Stock Exchange:8150 and NASDAQ: IMOS),an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),today reported its unaudited consolidated revenue for the month of December 2018and for the fourthquarter ended December 31,2018. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$30.61 toUS$1.00 as of December 31,2018.

Revenue for the month of December 2018was NT$1,538.0million or US$50.2 million,a decreaseof5.1%fromthe month of November 2018 and an increaseof 9.0% fromthe same period in2017.

Revenue for thefourth quarter of 2018 was NT$4,972.3 million or US$162.4 million,representing a decrease of 0.7%fromthe third quarter of 2018,and an increase of 12.8%from the fourthquarter of 2017.

The Company noted it is continuing to benefit from strong demand for TDDI with higher utilization levels of related wafer test,and mixed signal product. Revenue growth was adversely impacted by broader macro softness in the memory market.

Consolidated Monthly Revenues (Unaudited)

December 2018

November 2018

December 2017

MoM Change

YoY Change

Revenues

(NT$ million)

1,538.0

1,620.8

1,411.6

-5.1%

9.0%

Revenues

(US$ million)

50.2

53.0

46.1

-5.1%

9.0%

Consolidated Quarterly Revenues (Unaudited)

Fourth Quarter 2018

Third Quarter 2018

Fourth Quarter 2017

QoQ Change

YoY Change

Revenues

(NT$ million)

4,972.3

5,005.2

4,408.3

-0.7%

12.8%

Revenues

(US$ million)

162.4

163.5

144.0

-0.7%

12.8%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC.(Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park,Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan,ChipMOS provide assembly and test services to a broad range of customers,including leading fabless semiconductor companies,integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of,among other things,strategy,goals,plans or intentions. These statements may include financial projections and estimates and their underlying assumptions,statements regarding plans,objectives and expectations with respect to future operations,products and services,and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document,due to various factors. Further information regarding these risks,uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company's other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

jesse_huang@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

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